基于铜基的多层氮化硼薄膜（52.5cm）

简要描述：Specifications:
Close to complete coverage （90-95%）, with some minor holes
Average Thickness of BN film is 13 nm
Thickness of the copper foil is 20 microns
Quality is confirmed by TEM.

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更新时间：2026-04-09
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其他二维材料二维材料粉末二维材料溶液碲化物晶体硒化物晶体硫化物晶体绝缘体钙钛矿异质结 MOFS材料二维材料薄膜黑磷六方氮化硼查看全部产品

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

TEM image of perfect hexagonal structure

AFM image of multilayer BN on Cu

AFM scan of multilayer BN on Cu

上一篇：CVD六方氮化硼薄膜（基底可选）
下一篇：基于285nm二氧化硅基底的单层氮化硼薄膜

上海巨纳科技有限公司公司地址：上海市虹口区宝山路778号海伦国际大厦5楼技术支持：化工仪器网

联系人：袁文军
QQ：494474517
公司座机：86-021-56830191
邮箱：yuanwenjun@sunano.com.cn

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基于铜基的多层氮化硼薄膜（52.5cm）

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